On June 20,foreign media reported that the researchers at Xerox Parc(an American institute of science and technology) developed a new Micro-transfer printing technology which can be used to transfer Micro LED chips on a large scale. The technology can provide high performance, simple and robust structure, as well as the process of high scalability and high flexibility.

The new technology uses heat-induced adhesion modulation based on shape memory polymer (SMP) materials, in particular the application of a printer head using a individually addressable array of micromachined resistive heating devices, transfer heat locally to transfer a single Micro LED chip.

The researchers demonstrated the new technology in their paper and transferred chips measuring 50x50um with 100um Pixel spacing. It is understood that the transfer head can be dynamically configured to assemble micro-objects in any mode, thus achieving digital manufacturing, object classification or defect sequence assembly correction.


Principle of the transfer print head. (a) Schematic illustration of the structure of the transfer print head. (b) Illustration of the transfer pixel and the protocols for its pick-up and release operation.

 (Image Credit: AIP Advances Journal)

The transfer printing head is composed of a glass substrate, an array of micro-heating devices and a controllable adhesive layer made of SMP material.

The study is published in the 12th issue of AIP Advances, 2022.

Data show that Xerox Parc was founded in 1970 in Palo Alto, California, USA. It is a Xerox Research Institute, whose research and development achievements include laser printer, mouse, Ethernet, graphical user interface, Smalltalk, page description language, Interpress voice compression technology, etc. On January 4,2002, Xerox Parc became an independent company.

Paper links:https://doi.org/10.1063/5.0090890

Post time: Jun-24-2022